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A Data-Driven DNN-Based Fast Chip Thermal Solver

Jimin Wen, ANSYS INC | Akhilesh Kumar, Ansys

GTC 2020

Get to know ANSYS' strategy for the AI-based thermal solution of the modern chip-package-system design, as well as the data-driven DNN-based fast chip thermal solver we're going to announce. IC/package/system designers in the traditional semiconductor industry or 5G, automotive, and AI application will benefit the most from our session.

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